Tuesday, June 11, 2019

Solubility Products, Common Ion Effect, Hardness of Water: Discussion, Conclusion, Safety Notes


Discussion
            In general, springily soluble with math formula of LeChatelier’s principle has been useful on salt solubles. A low soluble can be a dynamically equilibrium so its concentration on its ion is low.
            Express BaSO4 in math formula on LeChatelier’s Principle has main compunds the Barium and Sulfate

BaSO4 (s)  º  Ba+2(aq)  + SO4-2 (aq)


The equilibrium expression for this reaction is:


 Since in a heterogeneous equilibrium the concentration of solid BaSO4 is a constant
for a given temperature, we can rewrite the expression as:


Ksp is called the solubility product constant.

            Many other has been issue on how soluble can be a sparingly soluble by modern gadget and equipment used. The solution is  Ca(OH)2 and the result is about small so its called sparingly soluble. Data shows how this happened and implies on mixing some concentration like NH3-NH4Cl solution in order to give better analysis on experiment. It solution can be determine the moles and its concentration calculations.  This data has substance of one mole Ca+2 and 2 moles OH-1 are present in solution.

The experiment also gives an idea of pertaining to the ph of substance that can be use if the solution is acidic or base. Some measurement as added like filtration paper in which some of its property like color has been change. PH indicator is good for detection how much acidic and base of substance is. This PH indicator for the measurement of [OH-1] in which it’s precisely measurement also th Ksp and the molar solubility. Ions have been added to solution to predict the molar solubility of said substances.

Conclusion

Hereby, this experiment has result, based on this the common ion was reduces the soluility of Sparingly Soluble Salt. We have 0.012 vs. 0.013. This agrees with LeChatelier’s principle.

Safety notes

On lab, always be ready for things, pls wear gloves cause substance can be irate skin, protect the eye, wear lab coat and be careful on chemical used. Don’t direct inhale near on experiment instead use mask for protection on do inhale and exhale near on experiment of chemistry. And be careful with indicator.


Solubility Products, Common Ion Effect, Hardness of Water : Experimental Procoline


            Procedures in experiment are interesting for scientist, student, or/ and researchers, chemist. Must be properly guide and be always have safely tools on it. There are 2 procedure on this experiment these are Determination of  Ksp  and Molar Solubility of Ca(OH)2
and Molar Solubility of Ca(OH)2 in the presence of Ca+2 .
Part I. Determination of  Ksp  and Molar Solubility of Ca(OH)2
1.      Prepare two 50-mL burets then clamp it. Fill each by a tap water and 1.25 x 10-3 Rinse the clean buret and on tap water dispense 25.00ml of water into a 125mL Erlenmeyer flask tip with two 2-mL portions of standardized NH3-NH4Cl solution Erlenmeyer flask.
2.      Next add 4 drops of eriochromeblack T indicator to the Erlenmeyer flash, Swirl, then place the Erlenmeyer flask under the burret containing the EDTA (red wine color). When it turns blue its good indication and the processed is done.
3.      Take a filter paper, fold it in quarters and partially in cone like a funnel and place it into 250 ml beaker. Slowly filter it on said experiment.
Rinse a 50-mL pipet with 1 or 2 mL of the saturated Ca(OH)2 solution and discard.  Pipet 50.00 mL of the filtrate into a clean 125-mL Erlenmeyer flask and add 4 drops of eriochromeblack T  indicator. Record the EDTA burret. Titrate with the standard HCl solution. Record the finaL volume (± 0.01mL) needed to just turn the solution color from red wine color to blue. Repeat the titration with two new samples of Ca(OH)2.

Part II. Determination of  Molar Solubility of Ca(OH)2 in the presence of Ca+2
1.      Repeat Part I, steps 2 – 3.
2.      Add 2ml of buffer solution to the Erlenmeyer flask followed by 4 drops eriochromeblack T indicator. Place this flask to burret with EDTA and record the titrate result done for the solution turn to blue.






Data
Part A
Name of salt being used is:                 Calcium sulfate
Formula of the salt being used is:        CaSO4
Mass of salt used is:                             0.5g
Volume of water used:                         125mL

Part 
Name of the same salt used as used in Part A is                    Calcium sulfate             
Formula of the same salt used as used in Part A is                 CaSO4            
Mass of salt used is:                                                                 0.5g
Identity of the common ion salt (Na2SO4 or NaF)                 Na2SO4                       
Concentration of the stock solution                                       0.01
Volume of the stock solution used                                         100 mL

Part C

Trial 1
Trial 2
Trial 3
Initial tap water buret reading/mL
0
 0
Final tap water buret reading/mL
25
 25
 25
Volume of the tap water dispensed from the buret/mL
25
 25
 25
Initial EDTA buret reading/mL
0
 0
 0
Final EDTA buret reading/mL
40
 40
40 
Volume of EDTA used for the titration/mL
40
 40
 40





Part D

Initial volume reading of buret containing the filtered salt solution 4.5 mL
Final Volume reading of buret containing th filtered salt solution 4.7 mL
Vcasoln = volume of the filtered salt solution used (32)-(31) is 0.2 mL
Initial volume reading of EDTA buret is 25 mL
Final volume reading of EDTA buret is 46 mL
VEDTA = Volume of EDTA used in (35)-(34) 25 mL


Part E
Initial volume reading of buret containing the filtered salt/common ion solution 40 mL
Final volume reading of buret containing the filtered salt/common ion solution 43 mL
Vcasoln =  Volume of filtered salt/common solution used = (41) – (40) = 3 mL
Initial volume reading of EDTA buret is 20 mL
Final volume reading of EDTA buret is 49 mL
VEDTA = Volume of EDTA used in (44)-(43) 29 mL





Solubility Products, Common Ion Effect, Hardness of Water : Introduction


     General term of equilibrium is zero balance on state, however in real thing it’s just a small fraction of state or body, for instance in body or thing which in state of little fraction of movement (according to formable bodies, branch of engineering materials, stress or strain) or in a branch of chemistry when ions concentrated on solution might slightly soluble. This follows a general description of LeChatelier’s principle.
        Mathematically a generic equilibrium on Ion effect of solution is reaction of a springily soluble salt having a general ratio
The corresponding equilibrium of expression (Ksp)


The ratio of cation to anion of 1:1.

The corresponding equilibrium of expression (Ksp)

Ratio 2:1


Ratio 1:2


Solubility Products, Common Ion Effect, Hardness of Water : Abstract


     In modern time, many discoveries are indeed useful to our health and to our society, this include the researches about salt that can be harmful to human if not tested carefully certainly by the expert and scientist. Upon of this, many apparatus and gadget in technology used about this and many procedure come up in a conclusion to benefits to human kind. In this case CT scans use for patient and these patients are given a springily soluble of salt, a suspension of  BaSO4 barium sulfate, just a little solubility because these are poisonous.

            Salts are springily soluble means it has low mass dissolves with water. Upon for this, the low concentration of solution has also low concentration of ions and slightly soluble.

            In this experiments, useful equipment are essential tools that properly instructed by standard and good things on procedures. A 50 mL burret (2), burret clamp, pipets and pi-pumps with some chemistry tools like beaker and stir rod are essential for this experiment. Carefully handle the tools and equipment with nice precision to have better results.

            The result of this experiment expected to be low solvent or the common ion reduces the solubility of Sparingly Soluble Salt that accordance to LeChatelier’s principle which states on equilibrium state of system will respond to restore a new equilibrium state, this could be near zero or balance.

Monday, June 10, 2019

Thermodynamic Concert with Semiconductor.

Thermodynamics or also know the study of energy forms that relate to physical science is useful on industries, country and this now said modern times.
Upon applied science, successful inventions are getting forward on a chemical reaction system that operates engines that relate to thermodynamics.
Chemical Kinetics or called reaction kinetics is a study of a rate of the chemical reaction by experimental by usually use if chemical reactors. <wikipedia.com>
The simplest type of reactor is a batch reactor. The material is loaded into the batch reactor and the reaction is allowed to continue over time. Discontinuous reactors do not reach the steady-state and often require temperature, pressure and volume control. Therefore, many discontinuous reactors have ports for sensors and inputs and outputs of materials. One example of a batch reactor is a pressure reactor.
This has a fluid reagent that stirred into a tank reactor by impeller for removing the effluent from a reactor. Division of volume of the tank by the average volumetric flow rate the tank over time that essential for a process on reactor fluid.
This reactor has a pump or tube that used for a pump a one or more fluid reagent. As the reagent passes through the PFR, the chemical reaction continues. In this type of reactor, the changing reaction rate produces a gradient with respect to the displacement distance. At PFR input, the speed is very fast, but as the product concentration increases, the reagent concentration decreases and the reaction rate decreases.
Semi-continuous reactors operate on continuous and batch inputs and outputs. For example, fermenters contain a medium that must be continuously removed and a stream of carbon dioxide that produces microorganisms.
Also implemented as plug flow reactors but a more complex process. The rate of the catalytic reaction is proportional to the amount of catalyst in contact with the reagent and the concentration of the reactants. Solid phase catalysts and liquid phase reactants are used which are directly proportional to the diffusion area of the reactants and products, the diffusion efficiency of the reactants and the efficiency of the mixture.
An ideal model does not mean axial mixing. Each liquid element passing through the reactor does not mix with the upstream or downstream liquid, as the term "component flow" implies.
Another thing to do is the reagent that placed within the reactor than the inlet that makes greater efficiency or low cost of the bar.
For efficiency, it has greater than a jacket of similar size. Also on speed percentage on jacket bar and not true for reversible feedback.
This is not 100% reaction complete, it has to do with a point on a dynamic equilibrium where reaction rate decrease.
Plug Flow Reactor use on the field of gas and liquid phase system for the use of it on gasoline production, oil crackling, synthesis of ammonia from that element and oxidation of sulfur dioxide to sulfur dioxide.

Good Coding Practices for Software developers

     Developers and most of them are on the right track that has a good result. In fact, in the behind of this prototypes, there is common no errors during the process of coding. This could be avoidable and be commonly used for a recheck and recognize it.
      There could be an action of 3 bad coding practices: the misalignment of code, also not put some comment on source code and make some typos errors.
      Would be good to have commented on the code in order to recognize more what that particular function does? Yes, the comment is a good habit of coding practices. Moreover, there is now IDE- Integrated Development Environment that can check the misalignment of code and typos errors.

 Being an analyst trainee, it is the first time encountered such algorithm that enhances coding skill. A worrying thing happened during on work time has been made, and that why be thankful for stuff that helped to solve some coding problems. There are some c programming exercises that encountered during that training. After all, the majority of problems depends on how virus embedded in PE header file and how it is being treated for the reverse engineering process. Due to the technical solution, there might be a solution, thanks to coworkers.
     Such an application is a need for its configuration, some step can check how its work.
Step 1.     It's quality and requirements
     Due to many designs of the product, it is important how this product's performance, set an expectation what would it is quality.
Step 2.     Check what it's a platform
     Many software packages have been modified for each platform. This suit its functionality.
Step 3.     Use the platform and also sharing is good.
     This includes the code quality of an application. Github is good for sharing information about software codes. And, JIRA is the most commonly used tool for bug tracking



     Being a developer consultant (on online), that was a heck of analyzing codes of c++. Some are not been made on time, however, thanks to the developer Zohar Mozafi he considered the time at true skills.  This had an exercise of c/c++ programming language. Some of the time to analyze is to get information on the internet. Many developers have encountered such as this.

Thursday, May 30, 2019

10 Important Things on Communication and Mass Media


1.             The definition of mass media is how the information is sent to many people and this answer is intended by using technology. Mass media can be a source of music, show or current issues like news so that mass audience stays update on these issues by knowing the detail that has been in form of newspapers, radio, internet, television, and magazines. Now the platform like the internet is more convenience than past time because of new technology in recent times. Upon this modern technology, mass media influence the public opinion which it possible to the public to view the events through TV and other video capturing device. On TV, a lot of commercials has been broadcast with lavish design and wonderful sound on a product that makes consumer behavior change and could buy those things. This mass media helps on innovating the industry to have more trends powerful economic.

2.    About process of information is referred to communication. There are components of sender-receiver model and this is:

·         Context- an idea makes its effective throughout communication also include aspects like an example of on a country that has unique communication from its own perspective.

·         Sender/Encoder – one who sends a message is called encoder who put an idea into spoken language, for instance, a sender who sends a message in understandable to a receiver. The encoder uses also symbols, graphs to get good respond.

·          Message- This is the information between sender and receiver that conveys an idea, for example, the point of the message is clear and concise.

·          Medium- It is the channel between the sender and receiver. For instance,  a sender sends message to a receiver  through a message, print, electronics, or speech which has sound.

·         Receiver/Decoder – a person who receive or recipient of a message. For instance, a person might receive an opinion.

·         Feedback – A response on receiver upon taking the message. For instance, feedback is an important role in business that enhances more products due to a feedback of consumers.

3.              Three forms of media, which are print, broadcast and digital. The print is the oldest form of media. Print includes newspaper, magazines. It's something to do with readership material that has facts like in news. A broadcast is a form of media that has embedded with a technology of television or radio, the audience listens to the information sent by this media and more of audience relies on a broadcast. Digital is the newest form of media, it comprises electronics device that can transmit a message like a readership, watch and listen form. It likes to be an internet based and some is stored info on an electronics device.

          For the technology become advance, audience interest on it that’s why many gadgets are now used for convenience and easier communication that people easily adapt to this technology. This gadget is now used and channel moved to modern class. 

4.             Mass media are considered profit centered. A lot of information is entertainment and lot of own of broadcast has a large products of large company which the number of medium like newspaper declined due to modern technology as it can be put in business so that the business ownership could use large scale of mass medium and called conglomerate that own media companies like Sony have own media called Micronics. This affects book industry because of modern gadget wide use for business.

5.              Many pop and culture are in form in music, dance, and classify as rock music and roll. Use of media can be enhancing its performance in build recognition on reconciliation to its own culture. The best medium for affecting culture is modern build technology. This is gadget filled with modern technology.

6.              The modern medium has much functionality and it has a friendlier user. Unlike to past time it looks like its evolve into modernized platform but books as medium has unique characteristics, it has to be handily and good to read on eyes, it has own purpose and unique subject and can be used by student on school for learning and it is said to be good for children for learning process and it has lavishly design and this is how book adapted over time.

7.              A newspaper is important to the public and it has been part of our daily like for several centuries. It’s kind of medium that are occurring around the world for inform of important events. It has been used by ancient Rome by carved the information on stone and over centuries the changed happened that newspaper is on paper by a printing press in the Unites States and through the world. Today it’s adapted also through modern gadget like a newspaper on the internet.

8.              The medium like visual video, sound, and other media outlet are combined and merge in one platform can be embedded on media are called Media convergence. Media convergence allows multiple media in one platform. For example, the live streaming on YouTube and the other is the comprehensive website with many multimedia on it.

9.              Importance of mass media is essential to our daily lives and through modern technologies, mass media is always getting used to on it even print is important for nowadays. The book can be used for educational purposes. Electronics media is also a new form of media that can be useful for business and economy in which the modern media is abode also on modern technology as a message is more explained and concise in a different form.

10.                 The film is one of the oldest medium used on humanity. The oldest is known on Chinese (painting) about 400BCE. The first motion film in the US is about 1878 AD. On the 19th century, the film has enhanced its brightness and color. The 20th-century film is now on cinema run by modern technologies. On recent time, there is a digital film. The film is important that why it remain as one of mass medium because it gives human to have the ability to connect human experiences, and in social activity.

Monday, May 27, 2019

Better Reader of IT-man (Information Technology)-man

     Writing clean code requires a lot of practice and effort and it is essential to the success of the project. But it is worth extra effort. These are good techniques in order to ensure high quality and maintainability code in projects. 
     These techniques include the variable name must be unique and easy to remember. Also, there is technology such do comment in a function that can be easily understood by another user. And another is a good function.
     In these given example techniques, giving a good comment on function is a technique that can be good to others, indeed it is recognized what function or code it does.

Sunday, May 26, 2019

Chemical Process Briefly Explained

     
   The batch process is a kind of chemical reactor that processed by a vessel in various operation in industries such as mixing of product, crystallization, polymerization, chemical reaction, solids dissolution.  This involves some structures like the body of the boiler, the agitator, and devices such as heat transfer, its transmission and the seal of a road.  Moreover, its feature generates it one is to one input to an output of materials that put and out on the reactor with efficient heat transfer, temperature and has flexible control, operate in reaction condition. There are some cases that its application needs a gas other than oxygen that fused on the inlet on the batch reactor liquids. This could be called aerators.

   Batch reactors are a generic term for the type of vessel widely used in the process industry. The name is an inappropriate name because this type of container is used for several process operations such as solvent dissolution, product mixing, chemical reaction, batch washing, crystallization, liquid / liquid extraction. The polymerization. In some cases, they are not called reactors, but they have names that indicate the role they play (as in crystallizers or bioreactors).
The principle of turbine flow meters has something to do with pipes, blades, and rotor. The rate of flow in pipes has been flowing on pipes via a rotor that spins and this flow has passed on its blades and the thing on this measurement is called turbine flow meter. Mathematically, the rotational speed of the rotor in pipes is a direct function of flow rate and its sensed by magnetic pick-up, photoelectric cell or gears.

     There are volumetric turbine flow meter and velocity turbine flow. These are basic classification types of this flow meter and have different units, mL/min for volumetric turbine flow and ft./sec for velocity turbine flow. Classification of Volumetric turbine flow can be in a state of gas or liquid and can be-be critical need for measurement in many industrial plants so that it has an accurate flow of measurement, for business to have gain profit on this operation in industries. Inaccurate measurement can result in distrust of people in their company. So as of be carefulness, there are important parameters to consider when specifying turbine flow meters include velocity flow rate range, liquid volumetric flow rate, operating pressure, fluid temperature, material density, and material viscosity in order to have met its accuracy. On the other types, the velocity flow applies sensor. rate range applies only to those turbine flow meters that are velocity flow sensors or meters. 

     Importance of this can be maximized its accuracy, include the parameter of pressure. Viscosity is an important role for this that make include on a process on turbine flow measurement. It’s dependable on materials needed that the turbine can be stand or withstand like in turbine exposure at some temperature. In relation to viscosity, the higher viscosity, the higher pressure drops, or lower viscosity the lower pressure drops so selection material must be considered as used. Also, the pipe diameter is important to use.

Cloud Computing Briefly Explained

     Unlike previous times, today's technology is very rich and sophisticated. The machine can now switch to the touch screen as a touch pad. The control panel has award-winning visualization data to ensure creative productivity in market competition. Use graphics to improve it and make navigating easier.

Cloud computing and its some applications

   Technology today is very enhancing and high, unlike the previous time.  A machine can now navigate on display of touch like a touchPad.  A dashboard has a winning display data, and it ensures creative productive on the market competition. Enhance this using graphs, and easy to navigate.

   One of the uses of cloud computing for email is retrieving and storing data and these are fast. That's why it relates to storing and even no individual hard drive is needed for sorting files. Here are examples of a company that offers Cloud Computing: Google Drive, as an experienced end user, Google offers storage like Microsoft Excel that can retrieve and store on the internet. This is called the Google sheet. Apple iCloud, Same for synchronization of email contacts, the calendar and etc. Amazon Cloud Drive, this about synchronization of music, hybrid synchronization for both file and music with time and Cloud Hardware, like Chromebook that is fully cloud-centric. Their application is about using the operating system that can synchronize every file, data like apps from a web browser to OS, and vice-versa. For much additional information about these visit to See at Their frequency and question asked and Their website online.

   For convenience, cloud computing is important to businessman and end users.  For play a role in managing the payroll system, the data is protected, the important files even not store in their memory card but on the internet as an intangible thing. For business, it raises Their income, as noted in an Economy, the demand, and supply law, when the demand is high then the price is high too but lowers the resource, the internet has not limited in one-thing, so the income is high for the businessman.
 In market strategies, the elasticity will measure up, it Serves as the demand basis scale.  it is possible to make a business about cloud for some study reasons. It can be in open public. For security, it should be in private.

Definition

   As definition, cloud computing is the practice of using a network of remote servers hosted on the Internet to store, manage, and process data, rather than a local server or a personal computer.

   Cloud computing is a type of computing that relies on shared computing resources rather than processing applications using local servers or personal devices.

   In the simplest case, cloud computing uses services ("cloud services") and moves them to the firewall of the organization. Applications, storage and other services are accessed through the web. Services are delivered and used through the Internet and paid by cloud customers according to the business model or payment for use as needed.

Conclusion as Benefits  

It might include the following:
  • Convenience
  • Scalability
  • Low costs
  • Security
  • Anytime, anywhere access
  • High availability.

GNS3 on Network

1. The layout of a network is from the data given from project 3. The aim of this is to assign the IP and MAC address for 3 hosts and add one host. The following are the step how the computer network works and the host pass data through switch –router –switch.



2. Each host has identified according to their IP address. This configuration is delivered by right-click the host icon and then choose console. Type IP [address] [netmask] [gateway]. The data is given and assigned to each host. The netmask is 255.255.255.0.



3. Each router has connected. Router Engineer, Montebello, and CEBIS are routers which its connect each other so the configuration on each ethernet has defined actually, to access IP address on each router connected, are numbered 3 like Engineer router to Montebello router and CEBIS router and to the switch.
Engineer Router Configuration


Montebello Router Configuration



CEBIS Router Configuration


4. The output is shown on a ping from PC2 to PC1. Actually, a ping has 4-6 times display passes through the network. Timeout not delivered or received data. The bytes there is the size of ping packet pass through the network. Packet means a mode of transmission which a message is in part make small and sent through a network on destination through route. The icmp_seq a fragmented request sent by router. TTL is the number of hop of packets how long takes these packets to a destination. It depends on number TTL.



5.Router IP Route and ARP
Engineering IP Route and ARP

Montebello IP Route and ARP


CEBIS IP Route and ARP


ARP or address resolution protocol is a protocol that representing IP address of hardware addresses of the remote and IP addresses set at the local endpoint. The router handles the IP connection to it, for example, PC1 is connected to Engineer Router so its show IP address of PC1 through Ethernet. However, IP route on the router can display the routes that network flows. Each terminal displays its IP address. This terminal can be kinds of ethernets, switches, and hubs.


6. PC1 its IP address is 10.1.1.1
PC2its IP addrees is 10.1.2.1
PC3 its IP address is 10.1.3.1
There is no arp on hosts.



7. PC1 MAC: 00:50:79:66:58:00
PC2 MAC: 00:50:79:66:58:01
PC3 MAC: 00:50:79:66:58:02
MAC address has been configured by type on console on host show ip.
8. There capture on other GNS3, the Wireshark can detect the map data from a network so that can be seen ff:



Each column has assigned as No. Time, source, destination, protocol, length, and info. It was captured on a network and this is a packet list to one packet that is in the capture file.Wireshark shows level of a protocol of high levels. The column No. is the number of the pockets and not change. Time is the timestamp. The source which packets are gathered from. A destination where the data or address where the packet is going to, Protocol, its name of protocol like TCP, or IP, length also included in each packet, the information is also given on info column.

9.
The new host is added on Montebello Router. The gateway of this host must same to the gateway to its network family on Montebella Router. The Ip configuration must different in level 10.1.2.x, the x range from 0 to 255 but its different to assigned at 10.1.2.1. same with the configuration on IP. Ping has been successfully configured.

The new host is added on Montebello Router. The gateway of this host must same to the gateway to its network family on Montebello Router. The Ip configuration must different in level 10.1.2.x, the x range from 0 to 255 but its different to assigned at 10.1.2.1. same with the configuration on IP. Ping has been successfully configured.
10. OSI layers or as known as open system interconnection which defines as a model for management in a network that implements protocol on a computer has 7 layers. The transmission through this is a definition of encapsulation and decapsulation of data which received and transmitted thought OSI layers. levels of OSI arrangement are application presentation session transport network datalink physical.For encapsulation, there is a movement of data from OSI layers from Presentation to Physical. Data packets containing headers and data from upper layers are converted into data to be repacked at the next lower level in the lower layer header. The header is supplementary information placed at the beginning of the data block at the time of transmission. This supplemental data is used at the receiving side to extract data from the encapsulated data packet. Packaging this data in each layer is known as data encapsulation. The reverse process of encapsulation (or decapsulation) occurs when data is received at the destination computer. When the data passes from the Physical of the TCP / IP protocol stack (input transmission), each layer decompresses the corresponding header and delivers the packet to the network application using the information contained in the header exactly the data waited for on the Application layer.


Final Output of Project 3.
Print Screen by GNS3.

Monday, May 20, 2019

Field-Effect Transistor Overview

Introduction
    
     Field-Effect Transistor is a three terminal device that has used in the semiconductor industry. It controls a voltage(unlike Bipolar Junction Transistor, current control). FET 3 terminals are a drain, source, and gate. The voltage on drain creates an electric field that creates an electric field to control a current flowing through a channel in a semiconductor.  In a large scale of development technology, it has a product that is useful I many semiconductor applications like gadgets and smartphone. Also, its operation has good on (Radio Frequency) RF technology and power control, also for a switch for general amplification.


Brief Explanation and Types

     Three terminals of FETs are known as Source, Drain and Gate.


     Field-Effect Transistor classifies into three,  a junction field-effect transistor(JFET), a metal-oxide-semiconductor field-effect transistor (MOSFET), and a metal-semiconductor field-effect transistor(MESFET).

     Due to the inherent sensitivity of the impedance of the drain source to the source voltage of the gate, the JFET can actually be used as a voltage control resistor.

   There are two types of MOSFET: depletion and enhancement. Each of MOSFET has transfer characteristics and this FET are similar to the transfer characteristic of JFET. The drain of MOSFET is continue but JFET can end.  The transfer characteristics is up to the IDSS level.

   The aarrow part of a JFET or MOSFET symbol of channel n always points to the center of the symbol, while that of channel p devices always lies outside the symbol.

 

   The vertical metal oxide and silicon FET (VMOS), a layer of SiO2 that locate in between the gate and the p-type region,is a metal surface connection to the terminal of the device, drain and source for the inductive n-type inductive channel growth . (Operation in improvement mode) VMOS has a positive temperature coefficient and there is the possibility of thermal leakage. The switching is faster than the traditional configuration.

   CMOS (complementary MOSFET) uses a unique combination of a pair of external leads, a p-channel MOSFET and a n-channel MOSFET. One of characteristics of CMOS is very high input impedance, other is fast switching speeds and low power levels of operation, CMOS is very useful in digital or logic circuits.

   The depletion type MESFET includes a metal-semiconductor junction, and as a result, characteristics can be obtained that match the characteristics of the n-channel depletion-type JFET. There are also MOSFET type enhancement features.

   MOSFETs are the most common transistors in digital circuits, and memory chips or microprocessors may include hundreds or hundreds of millions. Because it can be made of p-type or type semiconductors, complementary Mos transistor pairs can be used to implement switching circuits with very low energy consumption of CMOS logic.

     Microprocessor architecture A microprocessor is a unique IC packet in which many useful functions are incorporated and converted into a single silicon semiconductor chip. Its architecture consists of a central processing unit, memory modules, a bus system and input / output devices.

Conclusion

     Important characteristics of Field-Effect Transistor (FET) is its high input impedance (mega Ohms) compared to that of BJT (Kilo Ohms).


Sunday, May 19, 2019

Brief History of Microprocessor

Brief History of Microprocessor
(It is a data from Wikipedia)
Date Name Developer Max Clock Word size
(bits)
Process Transistors
1970 MP944 Garrett AiResearch 375 kHz 20 Multi-chip,pMOS Enhanced Mode
1971 4004 Intel 740 kHz 4 10 µm 2,250 pMOS
1972 PPS-25 Fairchild 400 kHz 4   Multi-chip, pMOS
1972 8008 Intel 500 kHz 8 10 μm 3,500 pMOS
1972 PPS-4 Rockwell 200 kHz 4   pMOS
1973 μCOM 4 NEC 1 MHz 4   2,500 NMOS
1973 IMP-16 National 715 kHz 16   Multi-chip, pMOS
1973 Mini-D Burroughs 1 MHz 8   pMOS
1974 IMP-8 National 715 kHz 8   Multi-chip, pMOS
1974 8080 Intel 2 MHz 8 6 μm 6,000 NMOS
1974 5065 Mostek 1.4 MHz 8   pMOS
1974 TLCS-12 Toshiba 1 MHz 12   NMOS
1974 CP1600 General Instrument 3.3 MHz 16   NMOS
1974 IMP-4 National 500 kHz 4   Multi-chip, pMOS
1974 4040 Intel 740 kHz 4 10 μm 3,000 pMOS
1974 6800 Motorola 1 MHz 8 - 4,100 NMOS
1974 TMS 1000 Texas Instruments 400 kHz 4 8 μm 8,000
1974 PACE National   16   pMOS
1974 ISP-8A/500 (SC/MP) National 1 MHz 8   P Channel MOS technology
1975 6100 Intersil 4 MHz 12 - 4,000 CMOS
1975 2650 Signetics 1.2 MHz 8   NMOS
1975 PPS-8 Rockwell 256 kHz 8   pMOS
1975 F-8 Fairchild 2 MHz 8   NMOS
1975 CDP 1801 RCA 2 MHz 8 5 μm 5,000 CMOS
two-chip
1975 6502 MOS Technology 1 MHz 8 - 3,510 dynamic NMOS
1975 BPC Hewlett Packard 10 MHz 16 - 6,000 + ROM
1975 MCP-1600 Western Digital 3.3 MHz 16 - Multi-chip, NMOS
1976 CDP 1802 RCA 6.4 MHz 8   CMOS
1976 Z-80 Zilog 2.5 MHz 8 4 μm 8,500 NMOS
1976 TMS9900 Texas Instruments 3.3 MHz 16 - 8,000
1976 8x300 Signetics 8 MHz 8   Bipolar
1977 Bellmac-8 (WE212) Bell Labs 2.0 MHz 8 5 μm 7,000 CMOS
1977 8085 Intel 3.0 MHz 8 3 μm 6,500
1977 MC14500B Motorola 1.0 MHz 1 CMOS
1978 6809 Motorola 1 MHz 8 5 μm 40,000
1978 8086 Intel 5 MHz 16 3 μm 29,000
1978 6801 Motorola - 8 5 μm 35,000
1979 Z8000 Zilog - 16 - 17,500
1979 8088 Intel 5 MHz 8/16 3 μm 29,000 NMOS HMOS
1979 68000 Motorola 8 MHz 16/32 3.5 μm 68,000 NMOS HMOS




Date
Name Developer Clock Word size
(bits)
Process Transistors
1980 16032 National Semiconductor - 16/32 - 60,000
1981 6120 Harris Corporation 10 MHz 12 - 20,000 CMOS
1981 ROMP IBM 10 MHz 32 2 µm 45,000
1981 T-11 DEC 2.5 MHz 16 5 µm 17,000 NMOS
1982 RISC-I UC Berkeley 1 MHz - 5 µm 44,420 NMOS
1982 FOCUS Hewlett Packard 18 MHz 32 1.5 µm 450,000
1982 80186 Intel 6 MHz 16 - 55,000
? 80C186 Intel 6 MHz 16 - ? CMOS
1982 80188 Intel 8 MHz 8/16 - 29,000
1982 80286 Intel 6 MHz 16 1.5 µm 134,000
1983 RISC-II UC Berkeley 3 MHz - 3 µm 40,760 NMOS
1983 MIPS Stanford University 2 MHz 32 3 µm 25,000
1984 68020 Motorola 16 MHz 32 2 µm 190,000
1984 32032 National Semiconductor - 32 - 70,000
1984 V20 NEC 5 MHz 8/16 - 63,000
1985 80386 Intel 16–40 MHz 32 1.5 µm 275,000
1985 MicroVax II 78032 DEC 5 MHz 32 3.0 µm 125,000
1985 R2000 MIPS 8 MHz 32 2 µm 115,000
1985  Novix NC4016 Harris Corporation 8 MHz 16 3 μm 16,000[35]
1986 Z80000 Zilog - 32 - 91,000
1986 SPARC Sun 40 MHz 32 0.8 µm 800,000
1986 V60 NEC 16 MHz 16/32 1.5 µm 375,000
1987 CVAX 78034 DEC 12.5 MHz 32 2.0 µm 134,000
1987 ARM2 Acorn 8 MHz 32 2 µm 25,000[37]
1987 Gmicro/200 Hitachi - - 1.0 µm 730,000
1987 68030 Motorola 16 MHz 32 1.3 µm 273,000
1987 V70 NEC 20 MHz 16/32 1.5 µm 385,000
1988 R3000 MIPS 12 MHz 32 1.2 µm 120,000
1988 80386SX Intel 12–33 MHz 16/32 - -
1988 i960 Intel 10 MHz 33/32 1.5 µm 250,000
1989 VAX DC520 "Rigel" DEC 35 MHz 32 1.5 µm 320,000
1989 80486 Intel 25 MHz 32 1 µm 1,180,000
1989 i860 Intel 25 MHz 32 1 µm 1,000,000
Date Name Developer Clock Word size
(bits)
Process Transistors (M) threads
per core
1990 68040 Motorola 40 MHz 32 - 1.2
1990 POWER1 IBM 20–30 MHz 32 1.0 µm 6.9
1991 R4000 MIPS Computer Systems 100 MHz 64 0.8 µm 1.35
1991 NVAX DEC 62.5–90.91 MHz - 0.75 µm 1.3
1991 RSC IBM 33 MHz 32 0.8 µm 1.0
1992 Alpha 21064 DEC 100–200 MHz 64 0.75 µm 1.68
1992 microSPARC I Sun 40–50 MHz 32 0.8 µm 0.8
1992 PA-7100 Hewlett Packard 100 MHz 32 0.80 µm 0.85
1992 486SLC Cyrix 40 MHz 16
1993 PowerPC 601 IBM, Motorola 50–80 MHz 32 0.6 µm 2.8
1993 Pentium Intel 60–66 MHz 32 0.8 µm 3.1
1993 POWER2 IBM 55–71.5 MHz 32 0.72 µm 23
1994 68060 Motorola 50 MHz 32 0.6 µm 2.5
1994 Alpha 21064A DEC 200–300 MHz 64 0.5 µm 2.85
1994 R4600 QED 100–125 MHz 64 0.65 µm 2.2
1994 PA-7200 Hewlett Packard 125 MHz 32 0.55 µm 1.26
1994 PowerPC 603 IBM, Motorola 60–120 MHz 32 0.5 µm 1.6
1994 PowerPC 604 IBM, Motorola 100–180 MHz 32 0.5 µm 3.6
1994 PA-7100LC Hewlett Packard 100 MHz 32 0.75 µm 0.90
1995 Alpha 21164 DEC 266–333 MHz 64 0.5 µm 9.3
1995 UltraSPARC Sun 143–167 MHz 64 0.47 µm 5.2
1995 SPARC64 HAL Computer Systems 101–118 MHz 64 0.40 µm -
1995 Pentium Pro Intel 150–200 MHz 32 0.35 µm 5.5
1996 Alpha 21164A DEC 400–500 MHz 64 0.35 µm 9.7
1996 K5 AMD 75–100 MHz 32 0.5 µm 4.3
1996 R10000 MTI 150–250 MHz 64 0.35 µm 6.7
1996 R5000 QED 180–250 MHz - 0.35 µm 3.7
1996 SPARC64 II HAL Computer Systems 141–161 MHz 64 0.35 µm -
1996 PA-8000 Hewlett-Packard 160–180 MHz 64 0.50 µm 3.8
1996 P2SC IBM 150 MHz 32 0.29 µm 15
1997 RS64 IBM 125 MHz 64 ? nm ?
1997 Pentium II Intel 233–300 MHz 32 0.35 µm 7.5
1997 PowerPC 620 IBM, Motorola 120–150 MHz 64 0.35 µm 6.9
1997 UltraSPARC IIs Sun 250–400 MHz 64 0.35 µm 5.4
1997 S/390 G4 IBM 370 MHz 32 0.5 µm 7.8
1997 PowerPC 750 IBM, Motorola 233–366 MHz 32 0.26 µm 6.35
1997 K6 AMD 166–233 MHz 32 0.35 µm 8.8
1998 RS64-II IBM 262 MHz 64 350 nm 12.5
1998 Alpha 21264 DEC 450–600 MHz 64 0.35 µm 15.2
1998 MIPS R12000 SGI 270–400 MHz 64 0.25 µm, 0.18 µm 6.9
1998 RM7000 QED 250–300 MHz - 0.25 µm 18
1998 SPARC64 III HAL Computer Systems 250–330 MHz 64 0.24 µm 17.6
1998 S/390 G5 IBM 500 MHz 32 0.25 µm 25
1998 PA-8500 Hewlett Packard 300–440 MHz 64 0.25 µm 140
1998 POWER3 IBM 200 MHz 64 0.25 µm 15
1999 Pentium III Intel 450–600 MHz 32 0.25 µm 9.5
1999 RS64-III IBM 450 MHz 64 220 nm 34 2
1999 PowerPC 7400 Motorola 350–500 MHz 32 200–130 nm 10.5
1999 Athlon AMD 500–1000 MHz 32 0.25 µm 22
Date Name Developer Clock Process Transistors (M) Cores per die /
Dies per module
2000 Athlon XP AMD 1.33–1.73 GHz 180 nm 37.5 1 / 1
2000 Duron AMD 550 MHz–1.3 GHz 180 nm 25 1 / 1
2000 RS64-IV IBM 600–750 MHz 180 nm 44 1 / 2
2000 Pentium 4 Intel 1.3–2 GHz 180–130 nm 42 1 / 1
2000 SPARC64 IV Fujitsu 450–810 MHz 130 nm - 1 / 1
2000 z900 IBM 918 MHz 180 nm 47 1 / 12, 20
2001 MIPS R14000 SGI 500–600 MHz 130 nm 7.2 1 / 1
2001 POWER4 IBM 1.1–1.4 GHz 180–130 nm 174 2 / 1, 4
2001 UltraSPARC III Sun 750–1200 MHz 130 nm 29 1 / 1
2001 Itanium Intel 733–800 MHz 180 nm 25 1 / 1
2001 PowerPC 7450 Motorola 733–800 MHz 180–130 nm 33 1 / 1
2002 SPARC64 V Fujitsu 1.1–1.35 GHz 130 nm 190 1 / 1
2002 Itanium 2 Intel 0.9–1 GHz 180 nm 410 1 / 1
2003 PowerPC 970 IBM 1.6–2.0 GHz 130–90 nm 52 1 / 1
2003 Pentium M Intel 0.9–1.7 GHz 130–90 nm 77 1 / 1
2003 Opteron AMD 1.4–2.4 GHz 130 nm 106 1 / 1
2004 POWER5 IBM 1.65–1.9 GHz 130–90 nm 276 2 / 1, 2, 4
2004 PowerPC BGL IBM 700 MHz 130 nm 95 2 / 1
2005 Opteron "Athens" AMD 1.6–3.0 GHz 90 nm 114 1 / 1
2005 Pentium D Intel 2.8–3.2 GHz 90 nm 115 1 / 2
2005 Athlon 64 X2 AMD 2–2.4 GHz 90 nm 243 2 / 1
2005 PowerPC 970MP IBM 1.2–2.5 GHz 90 nm 183 2 / 1
2005 UltraSPARC IV Sun 1.05–1.35 GHz 130 nm 66 2 / 1
2005 UltraSPARC T1 Sun 1–1.4 GHz 90 nm 300 8 / 1
2005 Xenon IBM 3.2 GHz 90–45 nm 165 3 / 1
2006 Core Duo Intel 1.1–2.33 GHz 90–65 nm 151 2 / 1
2006 Core 2 Intel 1.06–2.67 GHz 65–45 nm 291 2 / 1, 2
2006 Cell/B.E. IBM, Sony, Toshiba 3.2–4.6 GHz 90–45 nm 241 1+8 / 1
2006 Itanium "Montecito" Intel 1.4–1.6 GHz 90 nm 1720 2 / 1
2007 POWER6 IBM 3.5–4.7 GHz 65 nm 790 2 / 1
2007 SPARC64 VI Fujitsu 2.15–2.4 GHz 90 nm 543 2 / 1
2007 UltraSPARC T2 Sun 1–1.4 GHz 65 nm 503 8 / 1
2007 TILE64 Tilera 600–900 MHz 90–45 nm ? 64 / 1
2007 Opteron "Barcelona" AMD 1.8–3.2 GHz 65 nm 463 4 / 1
2007 PowerPC BGP IBM 850 MHz 90 nm 208 4 / 1
2008 Phenom AMD 1.8–2.6 GHz 65 nm 450 2, 3, 4 / 1
2008 z10 IBM 4.4 GHz 65 nm 993 4 / 7
2008 PowerXCell 8i IBM 2.8–4.0 GHz 65 nm 250 1+8 / 1
2008 SPARC64 VII Fujitsu 2.4–2.88 GHz 65 nm 600 4 / 1
2008 Atom Intel 0.8–1.6 GHz 65–45 nm 47 1 / 1
2008 Core i7 Intel 2.66–3.2 GHz 45–32 nm 730 2, 4, 6 / 1
2008 TILEPro64 Tilera 600–866 MHz 90–45 nm ? 64 / 1
2008 Opteron "Shanghai" AMD 2.3–2.9 GHz 45 nm 751 4 / 1
2009 Phenom II AMD 2.5–3.2 GHz 45 nm 758 2, 3, 4, 6 / 1
2009 Opteron "Istanbul" AMD 2.2–2.8 GHz 45 nm 904 6 / 1
Date Name Developer Clock Process Transistors (M) Cores per die /
Dies per module
threads
per core
2010 POWER7 IBM 3–4.14 GHz 45 nm 1200 4, 6, 8 / 1, 4 4
2010 Itanium "Tukwila" Intel 2 GHz 65 nm 2000 2, 4 / 1 2
2010 Opteron "Magny-cours" AMD 1.7–2.4 GHz 45 nm 1810 4, 6 / 2 1
2010 Xeon "Nehalem-EX" Intel 1.73–2.66 GHz 45 nm 2300 4, 6, 8 / 1 2
2010 z196 IBM 3.8–5.2 GHz 45 nm 1400 4 / 1, 6 1
2010 SPARC T3 Sun 1.6 GHz 45 nm 2000 16 / 1 8
2010 SPARC64 VII+ Fujitsu 2.66–3.0 GHz 45 nm ? 4 / 1 2
2010 Intel "Westmere" Intel 1.86–3.33 GHz 32 nm 1170 4–6 / 1 2
2011 Intel "Sandy Bridge" Intel 1.6–3.4 GHz 32 nm 995 2, 4 / 1 (1,) 2
2011 AMD Llano AMD 1.0–1.6 GHz 40 nm 380 1, 2 / 1 1
2011 Xeon E7 Intel 1.73–2.67 GHz 32 nm 2600 4, 6, 8, 10 / 1 1–2
2011 Power ISA BGQ IBM 1.6 GHz 45 nm 1470 18 / 1 4
2011 SPARC64 VIIIfx Fujitsu 2.0 GHz 45 nm 760 8 / 1 2
2011 FX "Bulldozer" Interlagos AMD 3.1–3.6 GHz 32 nm 1200 4–8 / 2 1
2011 SPARC T4 Oracle 2.8–3 GHz 40 nm 855 8 / 1 8
2012 SPARC64 IXfx Fujitsu 1.848 GHz 40 nm 1870 16 / 1 2
2012 zEC12 IBM 5.5 GHz 32 nm 2750 6 / 6 1
2012 POWER7+ IBM 3.1–5.3 GHz 32 nm 2100 8 / 1, 2 4
2012 Itanium "Poulson" Intel 1.73–2.53 GHz 32 nm 3100 8 / 1 2
2013 Intel "Haswell" Intel 1.9–4.4 GHz 22 nm 1400 4 / 1 2
2013 SPARC64 X Fujitsu 2.8–3 GHz 28 nm 2950 16 / 1 2
2013 SPARC T5 Oracle 3.6 GHz 28 nm 1500 16 / 1 8
2014 POWER8 IBM 2.5–5 GHz 22 nm 4200 6, 12 / 1, 2 8
2015 z13 IBM 5 GHz 22 nm 3990 8 / 1 2
2015 A8-7670K AMD 3.6 GHz 28 nm 2410 4 / 1 1
2017 Ryzen AMD 3.2–4.1 GHz 14 nm 4800 8, 16, 32 / 1, 2, 4 2
2017 z14 IBM 5.2 GHz 14 nm 6100 10 / 1 2
2017 POWER9 IBM 4 GHz 14 nm 8000 12, 24 / 1 4, 8
2017 SPARC M8 Oracle 5 GHz 20 nm ~10,000 32 8